Professional with 14 years of experience working in high-tech product development. Strong background in the management of semiconductor back-end operations (packaging, assembly & test) and product engineering. Known to be excellent at streamlining processes, and improving process efficiency, to accelerate "time to market" ("time to money"). Understands the tradeoffs between IC package performance and reliability. Specialties Semiconductor packaging selection and design. Package and device reliability testing (HTOL, HAST, ESD, MSL, TC, HTS). IC back-end operations. RF/Microwave design, signal integrity, and EMI considerations. Product life cycle management, product validation, documentation systems, and customer support activities. read more ...
  • Webster University - San Diego Campus
  • Senior Manager
  • Engineering Manager
  • Packaging Engineering At Gennum Corporation

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