Professional with 14 years of experience working in high-tech product development. Strong background in the management of semiconductor back-end operations (packaging, assembly & test) and product engineering. Known to be excellent at streamlining processes, and improving process efficiency, to accelerate "time to market" ("time to money"). Understands the tradeoffs between IC package performance and reliability. Specialties Semiconductor packaging selection and design. Package and device reliability testing (HTOL, HAST, ESD, MSL, TC, HTS). IC back-end operations. RF/Microwave design, signal integrity, and EMI considerations. Product life cycle management, product validation, documentation systems, and customer support activities.read more ...read less ...
Webster University - San Diego Campus
Senior Manager
Engineering Manager
Packaging Engineering At Gennum Corporation
Product Engineer At Sige Semiconductor
Product Evaluation At Amcc
Semiconductor Packaging At Applied Micro Circuits Corp.
Semiconductor Packaging Engineer At Amcc
Rfmicrowave Design Engineer At Ems Technologies Ltd.
Disclaimer: PeekYou is not a consumer reporting agency per the Fair Credit Reporting Act. You may not use our site or service, or the information provided, to make decisions about employment, admission, consumer credit, insurance, tenant screening or any other purpose that would require FCRA compliance. For more information governing use of our site, please review our Terms of Service.
Copyright 2024 PeekYou.com. A Patent Pending People Search Process. All Rights Reserved.
By continuing to use our site, you consent to the placement of cookies on your browser and agree to the terms of our Privacy Policy. More details